Western Digital Introduces 4 TB microSDUC, 8 TB SDUC, and 16 TB External SSDs - Related to good, 6.0, a, sduc,, cooler
PCI-SIG Demonstrates PCIe 6.0 Interoperability at FMS 2024
As the deployment of PCIe picks up steam in both datacenter and consumer markets, PCI-SIG is not sitting idle. And is already working on getting the ecosystem ready for the updats to the PCIe specifications. At FMS 2024, some vendors were even talking about PCIe with its 128 GT/s capabilities despite PCIe not even starting to ship yet. We caught up with PCI-SIG to get some updates on its activities and have a discussion on the current state of the PCIe ecosystem.
PCI-SIG has already made the PCIe specifications (v available to its members, and. Expects full specifications to be officially released sometime in 2025. The goal is to deliver a 128 GT/s data rate with up to 512 GBps of bidirectional traffic using x16 links. Similar to PCIe , this specification will also utilize PAM4 signaling and maintain backwards compatibility. Power efficiency as well as silicon die area are also being kept in mind as part of the drafting process.
The move to PAM4 signaling brings higher bit-error rates compared to the previous NRZ scheme. This made it necessary to adopt a different error correction scheme in PCIe - instead of operating on variable length packets. PCIe 's Flow Control Unit (FLIT) encoding operates on fixed size packets to aid in forward error correction. PCIe retains these aspects.
The integrators list for the PCIe compliance program is also expected to come out in 2025. Though initial testing is already in progress. This was evident by the FMS 2024 demo involving Cadence's 3nm test chip for its PCIe IP offering along with Teledyne Lecroy's PCIe analyzer. These timelines track well with the specification completion dates and compliance program availability for previous PCIe generations.
We also received an improvement on the optical workgroup - while being optical-technology agnostic, the WG also intends to develop technology-specific form-factors including pluggable optical transceivers, on-board optics. Co-packaged optics, and optical I/O. The logical and electrical layers of the PCIe specifications are being enhanced to accommodate the new optical PCIe standardization and. This process will also be done with PCIe to coincide with that standard's release next year.
The PCI-SIG also has ongoing cabling initiatives. On the consumer side, we have seen significant traction for Thunderbolt and external GPU enclosures. However, even datacenters and enterprise systems are moving towards cabling solutions as it becomes evident that disaggregation of components such as storage from the CPU and. GPU are improved for thermal design. Additionally maintaining signal integrity over longer distances becomes difficult for on-board signal traces. Cabling internal to the computing systems can help here.
OCuLink emerged as a good candidate and. Was adopted fairly widely as an internal link in server systems. It has even made an appearance in mini-PCs from some Chinese manufacturers in its external avatar for the consumer market, albeit with limited traction. As speeds increase, a widely-adopted standard for external PCIe peripherals (or even connecting components within a system) will become imperative.
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The iBUYPOWER AW4 360 AIO Cooler Review: A Good First Effort
iBUYPOWER is a organization known for its custom-built gaming PCs and peripherals. Established in 1999, the organization offers a wide range of self-branded products, including pre-built desktop computers, laptops, and gaming accessories. These products are designed to cater to various performance needs, from casual gaming to high-end competitive gaming. iBUYPOWER is particularly recognized for its customizable gaming PCs, allowing people to choose specific components . The organization's self-branded peripherals, like keyboards, mice, and headsets, are designed to complement their gaming systems, providing a cohesive experience for gamers.
iBUYPOWER also offers a selection of cooling-related products, including air and liquid cooling solutions. Tailored to ensure optimal thermal performance and custom aesthetics for their gaming systems. Most of these products are from other manufacturers, but the business is also branching out into selling their own cooling related products. Most notable of these is the new AW4 360 mm AIO liquid cooler. This review will focus on the AW4 AIO, evaluating its design, cooling efficiency, and overall performance within high-demand gaming and computing environments.
Cooler Specifications Type All-in-One Liquid Cooler Dimensions 397 x 120 x 52 mm (radiator with fan) Fans 3 x 120 mm Hydraulic Bearing Fans.
2000 RPM (max) RGB Yes (ARGB) Supported Sockets Intel: LGA1700 / LGA 115x.
AMD: AM5 / AM4 Warranty 3 Years Price $99.
We received the AW4 in a long. Sturdy cardboard box that hints the dimensions of the cooler. The black/red box is adorned with abstract shapes and a rendering of the cooler itself. Inside the box, the cooler is securely placed within custom-designed cardboard inserts. Ensuring its protection during transit.
iBUYPOWER provides only the absolutely essential parts required to use the AW4. Inside the box, we only found a basic manual, the required hardware to mount the cooler, and a cable for powering the three cooling fans. We should note that there is no LED controller included, a compatible motherboard is required for the LED lighting to work.
The three 120 mm fans included with the AW4 bear the iBUYPOWER logo and. We could not identify their OEM. They have an advanced sleeve bearing engine, notched fan blades, and soft anti-vibrational pads on their frame’s edges. There are no LEDs installed on them. Their speed range is rather narrow, ranging from 700 to 2000 RPM.
The iBUYPOWER AW4 360 mm AIO Liquid Cooler.
At first glance. The iBUYPOWER AW4 360 mm cooler closely aligns with the standard design of most 360 mm AIO coolers on the market. This cooler follows the typical AIO configuration, featuring a single radiator, two hoses. And a combined block that integrates a copper CPU contact plate with a compact liquid pump. iBUYPOWER employs black sleeved low-permeation rubber tubing, enhancing both flexibility and visual appeal.
The substantial radiator of the AW4 360 mm cooler, measuring 397 mm in length. Requires a case that can accommodate three 120 mm fans in sequence, with enough space for the radiator's additional dimensions. With a thickness of 27 mm, the radiator requires a total clearance of 55 mm when paired with fans to ensure proper installation. It adheres to the prevalent dual-pass cross-flow design, featuring small fins soldered onto thin, oblong tubes. There are no corporation logos or other adornments on the radiator.
The main block of the iBUYPOWER AW4 360 mm cooler is the only part of the cooler that has been designed to draw attention. It functions a smooth, round body with a high-gloss semi-transparent top cover with the business logo. The LEDs under the cover create an eye-catching faux 3D visual effect. The hoses are accommodated by 90° fittings on its side, and two cables exit from the same area—one 4-pin power cable and one for the RGB lighting.
At the bottom of the main block assembly. A squircle contact plate is attached to the plastic base cover with eight screws. The surface is not polished to a mirror finish but is sufficiently smooth and flat. There is a thermal pad pre-applied to the base.
The RGB lighting of the iBUYPOWER AW4 360 mm cooler is present at the top of the main cooling block alone. It is attractive and draws attention without being overwhelming, and. It syncs with any other RGB-equipped parts that are also connected to the motherboard’s RGB controller. The downside here is that the lighting of the AW4 will not function at all if it is not connected to a compatible RGB controller.
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Western Digital Introduces 4 TB microSDUC, 8 TB SDUC, and 16 TB External SSDs
Western Digital's BiCS8 218-layer 3D NAND is being put to good use in a wide range of client and enterprise platforms. Including WD's upcoming Gen 5 client SSDs and 128 TB-class datacenter SSD. On the external storage front, the corporation demonstrated four different products: for card-based media, 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds. And on the portable SSD front we had two 16 TB drives. One will be a SanDisk Desk Drive with external power, and the other in the SanDisk Extreme Pro housing with a lanyard opening in the case.
All of these are using BiCS8 QLC NAND. Though I did hear booth talk (as I was taking leave) that they were not supposed to divulge the use of QLC in these products. The 4 TB microSDUC and 8 TB SDUC cards are rated for UHS-I speeds. They are being marketed under the SanDisk Ultra branding.
The SanDisk Desk Drive is an external SSD with a 18W power adapter, and. It has been in the market for a few months now. Initially launched in capacities up to 8 TB, Western Digital had promised a 16 TB version before the end of the year. It appears that the product is coming to retail quite soon. One aspect to note is that this drive has been using TLC for the SKUs that are currently in the market. So it appears unlikely that the 16 TB version would be QLC. The units (at least up to the 8 TB capacity point) come with two SN850XE drives. Given the recent introduction of the 8 TB SN850X, an 'E' version with tweaked firmware is likely to be present in the 16 TB Desk Drive.
The 16 TB portable SSD in the SanDisk Extreme housing was a technology demonstration. It is definitely the highest capacity bus-powered portable SSD demonstrated by any vendor at any trade show thus far. Given the 16 TB Desk Drive's imminent market introduction, it is just a matter of time before the technology demonstration of the bus-powered version becomes a retail reality.
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Market Impact Analysis
Market Growth Trend
| 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
|---|---|---|---|---|---|---|
| 4.9% | 5.9% | 6.2% | 6.9% | 7.3% | 7.5% | 7.6% |
Quarterly Growth Rate
| Q1 2024 | Q2 2024 | Q3 2024 | Q4 2024 |
|---|---|---|---|
| 6.9% | 7.2% | 7.4% | 7.6% |
Market Segments and Growth Drivers
| Segment | Market Share | Growth Rate |
|---|---|---|
| Semiconductors | 35% | 9.3% |
| Consumer Electronics | 29% | 6.2% |
| Enterprise Hardware | 22% | 5.8% |
| Networking Equipment | 9% | 7.9% |
| Other Hardware | 5% | 5.3% |
Technology Maturity Curve
Different technologies within the ecosystem are at varying stages of maturity:
Competitive Landscape Analysis
| Company | Market Share |
|---|---|
| Apple | 18.7% |
| Samsung | 16.4% |
| Intel | 12.9% |
| NVIDIA | 9.8% |
| AMD | 7.3% |
Future Outlook and Predictions
The Demonstrates Pcie Interoperability landscape is evolving rapidly, driven by technological advancements, changing threat vectors, and shifting business requirements. Based on current trends and expert analyses, we can anticipate several significant developments across different time horizons:
Year-by-Year Technology Evolution
Based on current trajectory and expert analyses, we can project the following development timeline:
Technology Maturity Curve
Different technologies within the ecosystem are at varying stages of maturity, influencing adoption timelines and investment priorities:
Innovation Trigger
- Generative AI for specialized domains
- Blockchain for supply chain verification
Peak of Inflated Expectations
- Digital twins for business processes
- Quantum-resistant cryptography
Trough of Disillusionment
- Consumer AR/VR applications
- General-purpose blockchain
Slope of Enlightenment
- AI-driven analytics
- Edge computing
Plateau of Productivity
- Cloud infrastructure
- Mobile applications
Technology Evolution Timeline
- Technology adoption accelerating across industries
- digital transformation initiatives becoming mainstream
- Significant transformation of business processes through advanced technologies
- new digital business models emerging
- Fundamental shifts in how technology integrates with business and society
- emergence of new technology paradigms
Expert Perspectives
Leading experts in the hardware tech sector provide diverse perspectives on how the landscape will evolve over the coming years:
"Technology transformation will continue to accelerate, creating both challenges and opportunities."
— Industry Expert
"Organizations must balance innovation with practical implementation to achieve meaningful results."
— Technology Analyst
"The most successful adopters will focus on business outcomes rather than technology for its own sake."
— Research Director
Areas of Expert Consensus
- Acceleration of Innovation: The pace of technological evolution will continue to increase
- Practical Integration: Focus will shift from proof-of-concept to operational deployment
- Human-Technology Partnership: Most effective implementations will optimize human-machine collaboration
- Regulatory Influence: Regulatory frameworks will increasingly shape technology development
Short-Term Outlook (1-2 Years)
In the immediate future, organizations will focus on implementing and optimizing currently available technologies to address pressing hardware tech challenges:
- Technology adoption accelerating across industries
- digital transformation initiatives becoming mainstream
These developments will be characterized by incremental improvements to existing frameworks rather than revolutionary changes, with emphasis on practical deployment and measurable outcomes.
Mid-Term Outlook (3-5 Years)
As technologies mature and organizations adapt, more substantial transformations will emerge in how security is approached and implemented:
- Significant transformation of business processes through advanced technologies
- new digital business models emerging
This period will see significant changes in security architecture and operational models, with increasing automation and integration between previously siloed security functions. Organizations will shift from reactive to proactive security postures.
Long-Term Outlook (5+ Years)
Looking further ahead, more fundamental shifts will reshape how cybersecurity is conceptualized and implemented across digital ecosystems:
- Fundamental shifts in how technology integrates with business and society
- emergence of new technology paradigms
These long-term developments will likely require significant technical breakthroughs, new regulatory frameworks, and evolution in how organizations approach security as a fundamental business function rather than a technical discipline.
Key Risk Factors and Uncertainties
Several critical factors could significantly impact the trajectory of hardware tech evolution:
Organizations should monitor these factors closely and develop contingency strategies to mitigate potential negative impacts on technology implementation timelines.
Alternative Future Scenarios
The evolution of technology can follow different paths depending on various factors including regulatory developments, investment trends, technological breakthroughs, and market adoption. We analyze three potential scenarios:
Optimistic Scenario
Rapid adoption of advanced technologies with significant business impact
Key Drivers: Supportive regulatory environment, significant research breakthroughs, strong market incentives, and rapid user adoption.
Probability: 25-30%
Base Case Scenario
Measured implementation with incremental improvements
Key Drivers: Balanced regulatory approach, steady technological progress, and selective implementation based on clear ROI.
Probability: 50-60%
Conservative Scenario
Technical and organizational barriers limiting effective adoption
Key Drivers: Restrictive regulations, technical limitations, implementation challenges, and risk-averse organizational cultures.
Probability: 15-20%
Scenario Comparison Matrix
| Factor | Optimistic | Base Case | Conservative |
|---|---|---|---|
| Implementation Timeline | Accelerated | Steady | Delayed |
| Market Adoption | Widespread | Selective | Limited |
| Technology Evolution | Rapid | Progressive | Incremental |
| Regulatory Environment | Supportive | Balanced | Restrictive |
| Business Impact | Transformative | Significant | Modest |
Transformational Impact
Technology becoming increasingly embedded in all aspects of business operations. This evolution will necessitate significant changes in organizational structures, talent development, and strategic planning processes.
The convergence of multiple technological trends—including artificial intelligence, quantum computing, and ubiquitous connectivity—will create both unprecedented security challenges and innovative defensive capabilities.
Implementation Challenges
Technical complexity and organizational readiness remain key challenges. Organizations will need to develop comprehensive change management strategies to successfully navigate these transitions.
Regulatory uncertainty, particularly around emerging technologies like AI in security applications, will require flexible security architectures that can adapt to evolving compliance requirements.
Key Innovations to Watch
Artificial intelligence, distributed systems, and automation technologies leading innovation. Organizations should monitor these developments closely to maintain competitive advantages and effective security postures.
Strategic investments in research partnerships, technology pilots, and talent development will position forward-thinking organizations to leverage these innovations early in their development cycle.
Technical Glossary
Key technical terms and definitions to help understand the technologies discussed in this article.
Understanding the following technical concepts is essential for grasping the full implications of the security threats and defensive measures discussed in this article. These definitions provide context for both technical and non-technical readers.
PCIe intermediate
CPU intermediate
ASIC intermediate
RAM intermediate
platform intermediate
GPU intermediate
SSD intermediate
liquid cooling intermediate
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